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Lift-Off Stencil Created by Laser Ablation

IP.com Disclosure Number: IPCOM000065022D
Original Publication Date: 1985-Oct-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Donelon, JJ Tomkiewicz, Y Yeh, JT [+details]

Abstract

The present system uses a laser beam to ablate polymeric materials to create holes, vias, or lift-off stencils having a finite taper (undercut). The figure shows the present method used to ablate polymeric material to form avia or lift-off stencil. As shown in the figure, a laser beam 1 is directed at a reflecting surface 2. The reflecting surface 2 is positioned so as to redirect the laser beam at the angle of the desired undercut. Polymeric material on substrate 4 is mounted on a fixture 6 which permits both rotation 8 and translation 10. Rotating the fixture 6 causes the redirected laser beam to ablate a circular undercut via 12. Using both translation and rotation it is possible to create undercut holes of any desired shape and size. Preferably, a mask 14 is used.