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Method for Quantitatively Characterizing the Stability of Electroless Plating Baths Disclosure Number: IPCOM000065035D
Original Publication Date: 1985-Oct-01
Included in the Prior Art Database: 2005-Feb-19

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Junginger, R [+details]


For quantitatively characterizing the stability of a plating bath, the bath is mixed in time-controlled titration with defined quantities of its specific reducing agent or with a solution of metal salt until the respective metal is deposited. The quantities of reducing agent or metal salt solutions used for that purpose are a measure of the stability of the bath to be characterized. Example: The method is used to determine the stability of an additive bath employed during the manufacture of boards for depositing copper as a function of the added sodium cyanide, the wetting agent (GAFAC*) and the introduced air. For that purpose, a bath sample of 250 ml, agitated by a magnetic stirrer, is heated in a 600 ml beaker to 90ŒC (normal bath temperature 73ŒC).