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Surface-Mounted Device on Circuitized Thermoformable Sheets

IP.com Disclosure Number: IPCOM000065037D
Original Publication Date: 1985-Oct-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Karr, PC Schiller, JM [+details]

Abstract

This article describes techniques to create three-dimensional circuitry with thermoformed sheets to make possible mounting of a surface-mounted device (SMD) in a recess in the sheets in addition to surface mounting. In this manner, conformal, dense packages are fabricated that attach/ mount by snapfit or other applicable techniques. Referring to Figs. 1a, 1b and 1c, a circuitized and metallized sheet or film 1 is heat formed to a desired configuration (geometry) with depressions/wells 2 for SMD placement. Figs. 1a and 1b show SMD components 3 and 5, respectively, positioned in a well with planar leads 4 and 6 (not formed). The leads are connected to circuitry 15. Fig. 1c shows an SMD component with formed leads 8 in a well, with the leads positioned over circuit interconnections 9 within the well.