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Circuit Module Having Greater Chip Density

IP.com Disclosure Number: IPCOM000065059D
Original Publication Date: 1985-Oct-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Linsker, R [+details]

Abstract

An increase in the number of circuit chips attached to each circuit module is accomplished by eliminating the engineering design change (EC) pad that is usually pre-wired to each chip input/output (I/O) connection pad. Instead, a lesser number of chip I/O pads are reserved beneath each chip and these, in turn, are each connected to an EC pad by printed wiring. All chip I/O pads are normally directly connected via the module wiring and are not connected to the reserved I/O pads. When engineering changes are required, the chip is redesigned and the changed circuit is directed to one of the reserved I/O pads having an attached EC pad. A discrete wire is then used to interconnect from that EC pad with another connected to a different reserved I/O pad.