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Low-Profile Ceramic-Card Cooling Package Disclosure Number: IPCOM000065061D
Original Publication Date: 1985-Oct-01
Included in the Prior Art Database: 2005-Feb-19

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Fedoush, J Meyers, S Ricci, R [+details]


The packaging concept here described involves a novel integration of first- and second-level technologies to yield a product capable of high power dissipation. It provides a relatively inexpensive three-dimensional card-on-board package that can adequately and efficiently accommodate the cooling and mounting of ceramic cards on existing second- level packages. With reference to the illustration in Fig. 1, the disclosed package provides a two-sided ceramic card 1 with edge connectors on one side that allow it to be plugged into aboard. Adjustable water-cooled jackets (cold plates) 2 are installed by means of tracks on either side of the card and are brought into contact with the module caps '3' thereon, by means of a resilient, contour forming, heat conducting material (thermoplast) 4.