Browse Prior Art Database

Low Cost Non-Hermetic Module

IP.com Disclosure Number: IPCOM000065068D
Original Publication Date: 1985-Oct-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Meyers, S Presti, FP Siwy, MJ Walsh, TJ [+details]

Abstract

This article describes a low cost module for applications with reduced hermeticity requirements. Fig. 1 illustrates a module which utilizes a resilient, thermally enhanced plastic-like material, e.g., polyimide or other, as an exterior frame for all of its components, and an inexpensive cap/heatsink/internal thermal enhancement (CHI) assembly. The exterior frame 'z' can be formed of either 1 or 2 pieces utilized in, though not necessarily limited to, the following sequence of operations: a) A substrate 'x' is inserted between frame points A and B under sufficient, properly distributed pressure, to lock it into place in the overall assembly, as shown. The design of the assembly and its physical and thermal properties make it resilient enough to allow for proper positioning of the substrate in the assembly.