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Outer Lead Guard Bars for TAB

IP.com Disclosure Number: IPCOM000065116D
Original Publication Date: 1985-Oct-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Folsom, EE Morgan, FP Palmer, MJ Pollak, RA [+details]

Abstract

In a Tape Automated Bonding (TAB) system, as shown in Fig. 1, which is a top view looking down on a chip 11, beam leads 10 are supported near the inner bonding areas 14 on chip 11 by means of a polyimide square ring 12 which keeps the leads aligned as they are bent during manufacturing into the configuration shown in Fig. 2. Fig. 2is a side view with some of the leads and the ring 12 cut away for convenience of illustration. In Figs. 1 and 2, four strips 13 of polyimide or like polymeric or dielectric material are secured below the outer bonding areas 15 of the beam leads 10 which extend from the chip. These strips 13 further assure that the beam 10 leads will be held in alignment.