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Automatic Construction of a Distribution Shield for Thickness Profile Control of Evaporated Films

IP.com Disclosure Number: IPCOM000065133D
Original Publication Date: 1985-Oct-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Descamps, JP Fulconis, O [+details]

Abstract

Thickness profile monitoring of thin films deposited by vacuum evaporation is a problem manufacturing/engineering people working in the metallurgy area have been used to dealing with for a long time. Thickness uniformity can be reached through adequate substrate design, such as multi-level domes, for instance. Another solution is the use of a distribution shield placed between the evaporant source and a rotating dome. The manual construction of such a distribution shield, as is most often the case in metallurgy groups, is long and inaccurate. Precision is eventually obtained by a trial and error method, and small changes in the design of the shield. A mathematical model describing the shield in the case of planar or spherical substrates is developed.