Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19
If during burn-in semiconductor storage products are to be simultaneously AC/DC tested under normal conditions, several problems are encountered. These are attributable to the fact that the boards along with the devices to be tested have the same temperature as the devices themselves. Because of the warpage of the boards and contact problems resulting therefrom, sense amplifiers for product reading under real timing conditions cannot be provided on the boards, as their maximum temperature is 90ŒC, whereas the burn-in temperature ranges from 120 to 140ŒC. Therefore, it is proposed that the burn-in temperature be generated by means of ceramic plates of different local thermal conductivity rather than in an oven.