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Tool for Simultaneous Lifting of Semiconductor Circuit Chips

IP.com Disclosure Number: IPCOM000065269D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
DiMarco, GA Scianna, VD [+details]

Abstract

In semiconductor circuit chip manufacturing operations, it is frequently necessary to "pick" or lift a set of semiconductor chips from one location and deposit them in another. The tool described herein is for the use of an operator to manually perform such an operation. It utilizes a vacuum means for lifting the chips and features removable heads in the tool which are readily replaced for cleaning or to change the spacing configuration. As shown in section in the figure, the principal parts are the head 1, holder 2 and handle 3. The head 1 has protuberances 4, which may be typically cylindrical in shape, and are covered by sleeves 5 of material which is soft, such as plastic tubing, to protect against chip damage. Holes 6 permit air flow.