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Method for Soldering Pins

IP.com Disclosure Number: IPCOM000065270D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Ohkuma, H Watanuki, N [+details]

Abstract

Pins 1 are connected to plated through holes 2 in a substrate 3 with solder rings 4 by heating them with an infrared ray heater 5. Infrared ray transmitting glass covers 6, 7 with holes formed therein in the pin positions are disposed as illustrated above. These glass covers 6, 7 prevent small solder balls or solder splashes and/or flux gases from contaminating edge portions of the pins 1. A glass plate 8 transmitting infrared rays supports lower edges of the pins 1. By use of screws 9, the position of the glass plate 8 can be adjusted according to the size of the pins 1.