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Subsurface Soldered Integrated Circuit Module Pin

IP.com Disclosure Number: IPCOM000065273D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Redmond, RJ Ward, WC [+details]

Abstract

This article describes a method for pinning an integrated circuit (IC) module with preformed substrate holes and head pins that will result in a flush module surface for mounting chips. Preformed assembly parts are shown in Fig. 1. The pin hole 1 in the substrate 2 is countersunk 3 and the sidewall part way up is metalized with chrome-copper (Cr-Cu). The sidewall near the top and the hole pad surface 4 and metalized with chrome-copper-chrome (Cr-Cu-Cr). The pin 5 should be precisely dimensioned by cold heading for optimum solder filleting. The pin head 6 is fabricated on the side 7 so that it will mate with the substrate hole, and the top 8 of the pin head will be normal to the metalized chrome-copper (Cr-Cu) countersunk sidewall of the hole upon insertion. After the pin has been inserted into the hole (Fig.