Browse Prior Art Database

Heat Sink-Air-Laminar Bus

IP.com Disclosure Number: IPCOM000065276D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Andros, FE Asselta, JA Boyko, S de Paz, JF Meyers, JE Pergl, CE [+details]

Abstract

A removable, finned, air-cooled heat sink cools laminar bus bars on large printed circuit boards. The heat sink 1 has springs 2 which are held by rivets 3 for attachment to the bus 4. A high thermally-conductive "rubber-like" material 5 acts as the interface between the bus 4 and the heat sink 1. When the board 6 is positioned in its gate (not shown), the heat sink 1 is attached to the bus 4 with the fins 7 perpendicular to the floor, such that the fins 7 are parallel to the natural flow of air. The main body of the heat sink 1 has serrations 8, seen in the partial front view, to insure maximum flexibility and contact with the surface of bus 4. The small flange 9 at the bottom of the main body locks the heat sink 1 to the bus 4 to prevent it from vibrating loose. The heat sink is removable for engineering access.