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Non-Uniform Fin Shapes of Modules in Air-Cooled Environments

IP.com Disclosure Number: IPCOM000065284D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Baker, DL Palladino, MW Winnard, JR [+details]

Abstract

In many card on board applications modules are tightly spaced in a single air column. The introduction of fins as heatsinks increases surface area and lowers the Rexternal . The tight spacing causes a boundary layer of increasing thickness to be formed over the fin area as the air travels through the module column. The result of this boundary air layer is that higher Rexternals occur for each subsequent module in the column with the last module having the worst Rexternal . Alternate configurations for the fins permit improved Rexternals. In Fig. 1A the first module N starts with no boundary layer. The subsequent module N + 1 sees a slight boundary layer building, and the last module N + M has the thickest boundary layer. In Fig.