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Wafer Carrier Shock Absorber Disclosure Number: IPCOM000065312D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

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Related People

Kopecky, HR Rosenfeld, LH [+details]


In semiconductor manufacturing processes, wafers are transferred many times via wafer carriers. Damage is frequently incurred during the placement of the thin wafers into the carriers. This disclosure proposes the installation of a polymeric shock absorber in the carrier which will reduce the incidence of breakage. In a conventional wafer carrier, the shock absorber is normally made of a polymeric strand similar to a fishing line. With reference to Fig. 1, this provides a single point of contact 1 with the wafer 2 as it is deposited into the wafer carrier (not shown). The single line is subject to sagging and can easily be broken. During the transfer of a wafer, it drops 3" and is subject to being bounced. Breakage of the wafer is not uncommon. The invention is a shock absorber 3 made from a thin (0.