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Cap With Grooved Seal Band Designed to Retain and Contain in Place a Controlled Amount of Flowable Polymer Disclosure Number: IPCOM000065314D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

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DiPaolo, N Park, CH [+details]


The seal band of conventional ceramic or metal caps used in semiconductor processing is smooth and flat. It cannot properly retain in place a controlled amount of flowable polymer, making it impossible to effect a sound polymer seal between the substrate and the cap. A seal band structure has been developed which places a grooved seal band in the substrate's cap. This is effective in retaining the desired amount of polymer, thereby making it possible for a proper seal to be made. The seal band was originally designed to solder seal the cap to the substrate. In making a change to a polymer seal, it was found that the existing seal band could only accept a rigid polymer preform. It could not accommodate the flowable polymer formulations which are desirable for their elastomeric properties.