Browse Prior Art Database

Trenchfill Detect Site

IP.com Disclosure Number: IPCOM000065318D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Kent, JP [+details]

Abstract

A test site is disclosed which enables an operator to readily determine the extent to which the trenches on a semiconductor wafer have been filled with film material. This test site eliminates the need for scanning electron microscope (SEM) testing of the filled trenches. It is well known in the semiconductor processing art to form trenches in the surface of a wafer. These trenches are filled with a film material which isolates adjacent semiconductor structures from one another. It has been found that it is important to determine the extent to which these trenches are filled by the film material. For example, if the difference between the upper surface of the wafer and the upper surface of the film within the trench is greater than 0.