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Laser Plating on Insulators Without Seeding

IP.com Disclosure Number: IPCOM000065329D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Romankiw, LT Vigliotti, DR von Gutfeld, RJ [+details]

Abstract

It has previously been reported (R. von Gutfeld et al, IBM J . Res . and Dev . 26 136 1982) that lasers can be used to enhance both electro- and electroless-plating processes. In these prior techniques, either an initial metallic coating or activation of the surface is required to make depositions. It is of great interest to be able to deposit metal on insulators directly, both for circuit repair and circuit design. One particular application of considerable importance is the deposition directly onto epoxy-glass circuit boards. Present repair techniques for such circuit boards is quite cumbersome, requiring the soldering of thin wires between copper lines in the case of an open circuit.