Browse Prior Art Database

Flexible Module Carrier Direct Connection Package

IP.com Disclosure Number: IPCOM000065377D
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Motschman, DR Randolph, JB Wilson, DR [+details]

Abstract

By utilizing the Flexible Module Carrier (FMC) interconnection technology and the new Industry Standard JEDEC (Joint Electron Device Engineering Council), Type B or C, module packaging, memory modules may be more efficiently added to a system card. The FMC connector has a gold module pad mated to a gold pad directly processed onto the flex circuit, providing improved reliability. The JEDEC modules are now directly connected to a base carrier, the flex circuit, eliminating the need for separate module sockets. The individual modules are easily field-replaceable by removing retention bars which are metal and provide a cooling path for the modules. The figure shows the FMC direct connection packaging concept.