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Slit Crimp for Thermal Modules

IP.com Disclosure Number: IPCOM000065389D
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Arndt, SF Carden, TF Funari, J [+details]

Abstract

Thermal modules, consisting of a high density chip on a substrate, utilize thermally conductive grease, sandwiched between the cap and chip, to remove the heat generated by the chip to the atmosphere. The gap between the chip and cap is minimized to produce the shortest heat transfer path (through the grease), from chip to cap. To control this gap during the backseal (SCOTCHCAST*), the modules are held in clamps, as shown in Fig. 1. The clamps compress the module, forcing the substrate against the seating plane of the cap. The gap can also be controlled with a slit crimp which permits better wetting of the backseal and eliminates the clamps. The cap 1 (Fig. 2) holds the substrate 2 on the cap ledge 3. Slit crimps 4 are formed on the cap 1 (Fig. 3) by a compressive load applied by a wedge 5.