Browse Prior Art Database

Plated-Through Via Structure for a Thermally Enhanced Multilayer Flexible Module Carrier System

IP.com Disclosure Number: IPCOM000065400D
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Motschman, DR Randolph, JB [+details]

Abstract

For multilevel wiring in Flexible Module Carrier (FMC) applications, the thickness of flexible circuitry material is increased. This increases the overall thermal resistance of the package. The plated- through via structure described herein reduces this thermal resistance by providing a unique thermal path through the flexible material. The cross-sectional view of a single via 10 in the plated-through via structure is shown in Fig. 1. The via provides a high thermally conductive, continuous copper path embedded in the relatively nonconductive flexible material 12. The plated-through via structure consists of an array of vias on a discrete center-to-center spacing under the module site, as shown in Fig. 2. This array of vias provides multiple parallel heat conductive paths.