Browse Prior Art Database

Photoformed Chip Carrier

IP.com Disclosure Number: IPCOM000065406D
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Overfield, RB Singh, P [+details]

Abstract

An arrangement to manufacture high-density photoformed chip carriers is disclosed which employs a plastic material marketed by E. I. du Pont de Nemours & Co. under the name "photoformed plastic" or "PPM-Alpha." This material allows for the photographic formation of vias between multiple layers of dielectric which are interconnected using standard metalization and photo etch techniques. Figs. 1 and 2 show alternate packaging arrangements. Both pinned and surface-mounted components can be fabricated using this material. When compared to multilayer ceramic packages and metalized ceramic with polyimide, the advantages of photoformed chip carriers are as follows. Organic, ceramic, or metallic substrates may be employed, and the package is provided for effective cooling of high thermal loads.