Shock and Electrostatic Discharge Protective Linear Device Bank
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19
In semiconductor manufacturing operations, linear device banks (LDBs) are used to transport groups of chips, modules, and devices by automatic means. With the LDBs previously used, damage could result to the semiconductor components due to shock, electrostatic discharge (ESD) and abrasion. A modification has been developed which uses a thin transparent film molded into the LDB to provide a significantly improved mode of handling and transport. The improvement will reduce damage to C-4 (Controlled Collapse Chip Connector) pads. The LDB consists of a long slender container 1 into which devices 4 are nested (Fig. 1). The top and bottom consists of essentially identical molded covers which sandwich the devices 4 between them.