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High Performance Air-Cooled Module

IP.com Disclosure Number: IPCOM000065472D
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Chu, RC Simons, RE [+details]

Abstract

This high performance air-cooled module provides increased cooling capability with minimal impact to the system cooling hardware. As shown in the drawing (open view), multiple pistons 1 per chip 2 are used within the module to effectively conduct heat from the chips to the cap 3. Cooling fins 4 are attached to the cap to allow heat removal by forced convection with air. Constructing both fins and cap of a high thermal conductive alloy (e.g., zirconium-copper or beryllium-copper) maximizes thermal efficiency. An adhesive joint 5 is provided around the perimeter of the module between the substrate and cap, to affix the cap to the substrate, while allowing for differential expansion and contraction resulting from differences in the thermal coefficient of expansion of the materials.