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Circuit Package With Spring-Loaded Pistons Holding Cooling Plate Against Chip and With Flexible Material Holding Cooling Plates and Sealing Chips From a Cooling Fluid

IP.com Disclosure Number: IPCOM000065476D
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Chu, RC [+details]

Abstract

Several large chips are mounted in an array on a chip carrier. A chip cooling plate of a suitable metal is located over each chip. A flexible material carries the cooling plates and cooperates with the chip carrier to form an enclosure for the chips. A metal header is mounted over the flexible material and cooperates with the flexible material to form an enclosure for a coolant, such as a dielectric liquid. The cooling plates have fins that project into the coolant enclosure. The header carries an array of pistons for each cooling plate, and the finned surface of the cooling plate is adapted to receive the lower ends of the pistons. The pistons are spring-loaded to hold the cooling plate against the chip.