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Dual-Mode Z-Stage Mechanism

IP.com Disclosure Number: IPCOM000065502D
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Byrnes, HP Wahl, R [+details]

Abstract

This article describes a high force, stable, semiconductor wafer prober Z-stage mechanism capable of functioning in either a controlled-force or a controlled-deflection probing mode. A short, rigid, test probe may be employed in high density wafer product testing. This requires wafer probers with Z-stages which operate in force-mode, thereby providing a controlled contact force during test. Such a Z-stage must provide force constancy at increased contact forces, for increased contact quantities, and with increased wafer sizes. It must also provide very well controlled pad-to-probe engagement, and its wafer chuck must be rotatable to allow for theta adjustment. When rigid probing, even at the periphery of large wafers, it is vital that the Z-stage design be such as to incur intimacy of contact during test.