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Circuit Modules With Vertically Extending Grooves Providing Capillary Action for Distributing an Evaporating Dielectric Liquid Disclosure Number: IPCOM000065538D
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue


Related People

Chu, RC [+details]


Circuit modules are mounted in a row and column array on a vertical planar support that is held inside an enclosure. A small rectangular pan for holding a dielectric liquid is located along the bottom edge of each module with the lower edge of the module in contact with the liquid. The dielectric liquid rises across the surface of the module by capillary action and cools the module by evaporation. A water-cooled heat exchanger is located at the top of the enclosure, and the dielectric vapor condenses on the surface of the heat exchanger. The pans on the modules are made wider toward the bottom of the array in a terraced configuration. A number of planar supports are mounted in the enclosure, and the pan for a module at the bottom of the array extends substantially to the next module support.