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Foil Interposer Located Between Cold Plate and Hat of TCM With Water-Carrying Perforations for Reduced Thermal Resistance

IP.com Disclosure Number: IPCOM000065546D
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Antonetti, VW Eid, JC [+details]

Abstract

A thin foil is provided with many small holes that hold water by capillary action. The wetted foil is located between a cold plate and the hat of a thermal conduction module (TCM), and the water provides improved heat transfer between the hat and the cold plate. Other liquids such as ethylene glycol may be substituted for water. A seal may be attached to the periphery of the foil, and it can give the foil sufficient rigidity for handling during manufacturing.