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Substrate Contact for a Trench Structure

IP.com Disclosure Number: IPCOM000065561D
Original Publication Date: 1985-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Mongeon, SA Potter, MD [+details]

Abstract

A substrate contact is made to a semiconductor substrate of a chip from the surface of an epitaxial layer by utilizing the voltaic properties of a P-N junction for plating metal around the periphery of chip.