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Unique Process for Bonding Silicon Nozzle Plate Onto Drop-on-Demand Printhead

IP.com Disclosure Number: IPCOM000065592D
Original Publication Date: 1985-Feb-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Liclican, L Moss, J Semple, WE [+details]

Abstract

A method is described for bonding a silicon nozzle plate onto an ink jet print head by means of a patterned epoxy coating. Each coating thickness is represented by a different pattern, so pictures of different thicknesses could be used to compare/match the pattern being produced on the work surface. This is an easy method for control of thickness of deposited films.