Unique Process for Bonding Silicon Nozzle Plate Onto Drop-on-Demand Printhead
Original Publication Date: 1985-Feb-01
Included in the Prior Art Database: 2005-Feb-19
A method is described for bonding a silicon nozzle plate onto an ink jet print head by means of a patterned epoxy coating. Each coating thickness is represented by a different pattern, so pictures of different thicknesses could be used to compare/match the pattern being produced on the work surface. This is an easy method for control of thickness of deposited films.