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Method for Forming Seal Ring for Circuit Module

IP.com Disclosure Number: IPCOM000065610D
Original Publication Date: 1985-Mar-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Chiang, SW Hayunga, PC Lipschutz, LD [+details]

Abstract

An improved seal is provided for a chip carrier of the type that is sealed to an enclosing structure with a seal ring that is located between the perimeter of the chip carrier and the enclosing structure. The seal ring is initially formed in a circular shape and is then bent into the shape of a square that matches the mating surfaces of the chip carrier and the enclosing structure except that the corners of the seal are more rounded than the corners of the mating surfaces. A better match between these corners is obtained by overbending the ring so that each of its four sides bows inward toward the center of the carrier. The overbending displaces the corners of the ring diagonally outward away from the corners of the flange.