Browse Prior Art Database

Low Cost Electronic Assembly

IP.com Disclosure Number: IPCOM000065624D
Original Publication Date: 1985-Apr-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
DeVane, G [+details]

Abstract

Large foam or plastic electronic enclosures are difficult to design and build with sufficient structural rigidity. Adding sub-assemblies compounds the problem.