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Process for Improving Film Adhesion And Solderability

IP.com Disclosure Number: IPCOM000065645D
Original Publication Date: 1985-Apr-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Lazzarini, DJ Pernes, RJ Pessarchick, JJ [+details]

Abstract

The adherence of a solder resist film marketed as Vacrel 930 by E. I. duPont de Nemours and Company, Wilmington, Delaware, can be improved in some instances by additional baking. When baking is extended to two hours at 140ŒC, outgassing of volatile components is assured and excellent film adhesion and subsequent improved solderability is achieved.