Soldering of Surface Mounted Components
Original Publication Date: 1985-May-01
Included in the Prior Art Database: 2005-Feb-19
The article describes a technique for packaging surface mounted components (SMC) to cards/boards. The technique requires that a solder whose melting point is relatively low be used to attach the SMC to its repsective card/board. The low melting solder may be used with a wave soldering process, a reflow process or any other suitable process.