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Pd Seeder Activity for Electroless Cu Plating of Epoxy

IP.com Disclosure Number: IPCOM000065670D
Original Publication Date: 1985-May-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Alnot, P Auerbach, D Brundle, CR Miller, DC [+details]

Abstract

The palladium (Pd) seeder activity of a palladium/tin (Sn) layer is increased by converting the Pd ion to PdŒ (metal). The Pd/Sn layer is typically applied to an epoxy surface prior to being copper plated electrolessly. The Pd ion is converted to PdŒ by subjecting the Pd/Sn layer to a rinse with a .025M H2CO solution (0.074 wt %) at 73ŒC. The H2CO rinse, when done immediately prior to plating, improves the reliability and reproducibility of the copper plating process.