Pd Seeder Activity for Electroless Cu Plating of Epoxy
Original Publication Date: 1985-May-01
Included in the Prior Art Database: 2005-Feb-19
The palladium (Pd) seeder activity of a palladium/tin (Sn) layer is increased by converting the Pd ion to PdŒ (metal). The Pd/Sn layer is typically applied to an epoxy surface prior to being copper plated electrolessly. The Pd ion is converted to PdŒ by subjecting the Pd/Sn layer to a rinse with a .025M H2CO solution (0.074 wt %) at 73ŒC. The H2CO rinse, when done immediately prior to plating, improves the reliability and reproducibility of the copper plating process.