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Prevention of Semiconductor Chip Metal Blistering Technique Disclosure Number: IPCOM000065704D
Original Publication Date: 1985-Jun-01
Included in the Prior Art Database: 2005-Feb-19

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Chicotka, RJ Emmons, DF Schnitzel, RH [+details]


The blistering of chromium, aluminum-copper films employed as a first-level metallurgy on semiconductor chips is identified with poor control of the water bleed used in the reactive oxidation of chromium-chromium-oxide. Disclosed here is a method whereby the back-fill and associated changes in the existing metal evaporator schedule. A sufficient number of evaporation runs have been conducted using the disclosed method to allow for verification of the absence of blisters under microscopic inspection.