Prevention of Semiconductor Chip Metal Blistering Technique
Original Publication Date: 1985-Jun-01
Included in the Prior Art Database: 2005-Feb-19
The blistering of chromium, aluminum-copper films employed as a first-level metallurgy on semiconductor chips is identified with poor control of the water bleed used in the reactive oxidation of chromium-chromium-oxide. Disclosed here is a method whereby the back-fill and associated changes in the existing metal evaporator schedule. A sufficient number of evaporation runs have been conducted using the disclosed method to allow for verification of the absence of blisters under microscopic inspection.