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Improved Ultrasonic Bonding Wedge

IP.com Disclosure Number: IPCOM000065734D
Original Publication Date: 1985-Jul-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Liu, K Shariff, RS [+details]

Abstract

With conventional ultrasonic bonding wedges, the reliability of the ultrasonic bond is very low and bonder down time is excessive whenever parameters such as wire ductility, contamination and bond pad surface finish vary. A side view of both the conventional ultrasonic bonding wedge and theimproved bonding wedge is illustrated in Fig. 1. In the improved bonding wedge the views A-A and B-B, which are at a scale of 100 to 1, illustrate a new longitudinal groove 10 and a rough surface 12 along the groove. The longitudinal groove 10 with the rough surface 12 is used to grip the wire. This allows more efficient energy transfer and results in a good ultrasonic bond which is devoid of nugget lifts in destructive testing. With the improved bonding wedge, bonder down time has been reduced by approximately 50%.