Enhanced Cooling for Double Sided Components
Original Publication Date: 1985-Aug-01
Included in the Prior Art Database: 2005-Feb-19
Double sided mounting of electronic components increases the density of heat generation. The present invention is directed to a cold plate which when placed between surface soldered cards can be used to enhance the air cooling and thereby allow more heat to be dissipated. Figure 1 shows the cold plate of the present invention position between cards. Figure 2 is an exposed side view of the cold plate of the present invention and shows the channels for confining the path of the cooling fluid used to cool the cold plate of the present invention. Since using the cold plate of the present invention allows for better cooling, card packing density can be increased, wiring enhancement maintained, and higher power density used.