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Screened Polymer Thick Film Resistors And Metallization On Thick Anodic Coatings

IP.com Disclosure Number: IPCOM000065784D
Original Publication Date: 1985-Sep-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Mahmoud, IS Schrottke, G [+details]

Abstract

Polymer thick film resistors and metallization layers can be screened onto thick anodized aluminum coatings. In the prior art, anodized aluminum has been used frequently in the fabrication of electrical circuitry, but the primary purpose thereof has been using the aluminum as a stiffener and to improve adhesion of polymers which act as the dielectric material. At the present time there are not believed to be any commercially available products in which both power resistors and metallization layers are deposited or screened on an anodized aluminum layer. The advantages of the present fabrication technique include: 1. No size restriction or limitation imposed on the electrical circuitry. 2. Integral power resistors can be produced directly on the anodic coating. 3.