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Chip Preparation For Auger Analysis of High Resistance Vias

IP.com Disclosure Number: IPCOM000065807D
Original Publication Date: 1985-Sep-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Gajda, JJ Blake, HH, Jr. [+details]

Abstract

The presented technique provides a method of gaining access to interfacial films for Auger analysis. Interfacial films, within vias, contribute toward undesirable high via resistance.