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The presented technique provides a method of gaining access to interfacial films for Auger analysis. Interfacial films, within vias, contribute toward undesirable high via resistance.
English (United States)
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Chip Preparation For Auger Analysis of High Resistance Vias
The presented technique provides a method of gaining access to interfacial
films for Auger analysis. Interfacial films, within vias, contribute toward
undesirable high via resistance.
Chips are placed on a one-inch stainless steel cylinder l. The outer chips 2
act as outriggers for parallel polishing. The center chip 3 has the failed vias. The
stainless steel cylinder is placed on a diamond polishing wheel, with the chips
contacting the wheel. The removal rate is determined by the weight of the
stainless steel cylinder and the diamond wheel grit size. As grinding proceeds
closer to the interface, the diamond grit size becomes smaller. Once the
surrounding glass is polished, it imparts fringe colors. Using a xenon light
source, these colors are calibrated to surface-to-interface thickness.
When the correct color is reached, a chemical polish etch
solution with a known etch rate is used. The etch solution also
smooths out the surface, which is needed for auger profiling. The
solution developed for uniform Al-Cu removal and surface topography
flatness follows: l3 ml - HN03 l6 ml - NH4F 0.2 g -
PbNO3 2 liters - H20 Disclosed anonymously