Process for Forming Conductor Patterns on Ceramic Substrates
Original Publication Date: 1985-Oct-01
Included in the Prior Art Database: 2005-Feb-19
By this process conductive metal patterns are formed on embossed dielectric substrates without the use of masks. In multilayer ceramic semiconductor package technology the ceramic substrate is fired after a pattern of conductive stripes or pads of a refractory metal is deposited. During sintering, a ceramic substrate may shrink non-uniformly, thereby distorting the pad or stripe pattern. This can make a matchup of the pads and stripes with masks for depositing additional patterns of higher conductivity metal impossible. In this process the top layer of a stack of ceramic green sheets is molded or embossed at elevated temperature and pressure, forming a pattern of raised areas 10 and recessed areas 12 with essentially perpendicular walls 14 in substrate 16.