Electrical Defect Inspection
Original Publication Date: 1985-Oct-01
Included in the Prior Art Database: 2005-Feb-19
A method has been proposed to electrically inspect wafers for defects in the photoresist (PR) step in semiconductor processing. The method would greatly increase the number of chips inspected, provide a correlation with the post-aluminum kerf (PAK) test, eliminate current time-consuming inspections and provide an early detection of faults so that rework can be readily accomplished.