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A Printer Circuit Card With Filled Vias for Surface Mount Technology

IP.com Disclosure Number: IPCOM000065883D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Bakos, P Baldauf, LM Napp, D [+details]

Abstract

A Method of manufacturing printed circuit cards is described which results in improvements in both raw card manufacturing and the attachment of surface mounted components. This is accomplished by filling the vias or plated-through-holes with epoxy or some other polymer after the plating process. This method allows the use of an aqueous resist for the creation of circuitry on the external surface of the card. Also, this method reduces the amount of solder used when assembling surface mounted components onto pads which contain vias, as well as having other advantages over the current state-of-the-art.