Browse Prior Art Database

Enhanced Photoresist Developing and Stripping

IP.com Disclosure Number: IPCOM000065892D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Daigle, RC Gelorme, JD Lawrence, WH [+details]

Abstract

The heating of a photoresist coated printed circuit board (PCB), or the like, enhances the developing or stripping of the photoresist material. Increasing the photoresist temperature allows for greater penetration into and faster dissolution of the photoresist. The procedure for this enhancement is described in the following.