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Enhanced Photoresist Developing and Stripping Disclosure Number: IPCOM000065892D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

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Daigle, RC Gelorme, JD Lawrence, WH [+details]


The heating of a photoresist coated printed circuit board (PCB), or the like, enhances the developing or stripping of the photoresist material. Increasing the photoresist temperature allows for greater penetration into and faster dissolution of the photoresist. The procedure for this enhancement is described in the following.