Browse Prior Art Database

Mask Insulator for Empty Chip Sites

IP.com Disclosure Number: IPCOM000065894D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Horvath, JL Hultmark, EB [+details]

Abstract

Described is the design of a semi-rigid, non-conducting, thin film overlay that fits the perimeter measurements of a multichip module. The overlay contains the proper vertical contours in either simple form or other geometric contours to accurately accommodate the geometry of the chip carrier pattern, see the Figure. The "waffle" characteristic allows the film to be congruent with the surface of the multichip carrier.