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"S" Bend Support for Radial Finger Contact Clusters

IP.com Disclosure Number: IPCOM000065895D
Original Publication Date: 1985-Nov-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Landstein, L [+details]

Abstract

The "S" bend as shown in the Figure also provides contact relief from torque stresses produced during thermal cycling of the assembly. The design of the "S" bend results in less area (real estate) being required for this support and therefore is useful in multichip modules. It also acts as a secondary heat transfer path for the chip assembly.