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Locating System for Multilayer Printed Circuit Panels

IP.com Disclosure Number: IPCOM000065920D
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Banks, WE Tuttle, JD Winters, RJ [+details]

Abstract

The present method of manufacturing printed circuit panels usesa locating system whose images are located on a panel in the internal circuitization process of a multilayer product. These locating holes are .250 inch in diameter. If these panels are processed through the internal circuitization process more than once, these locating holes must have the photo-sensitive resist removed from these holes with a hot soldering iron and a bristle brush. The resist must come down over the holes in order to protect the copper on the rest of the panel from being etched away. When this resist is removed by this "hole burnout" operation, two things occur: 1. Distortion of the locating hole occurs. 2. Resist debris is generated which causes contamination.