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Lead Connector for Multi-stack Module Used in Surface Mount Technology Disclosure Number: IPCOM000065935D
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19

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Kryzaniwsky, BR [+details]


This article describes a means for preserving the mechanical and electrical integrity of flat planar lead solder joints used in solid state electronic assemblies during and after successive solder reflow operations. This technique is especially useful in surface mount technology where components are placed on pads which are coated with solder paste and the assembly undergoes vapor phase solder reflow.