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Sponge-type Contact Material for Good Thermal Transfer

IP.com Disclosure Number: IPCOM000065936D
Original Publication Date: 1985-Dec-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Chang, AY [+details]

Abstract

This disclosure describes an improved method of providing heat sinks to semiconductor chips and other circuit contacts. Extraction of heat from semiconductorassemblies is critical to the life and reliability characteristics of the circuits during "in process" testing. Before final packaging, the use of conductive gases, greases or liquids for heat transfer is not practical, so the transfer is accomplished with metal-to-metal contacts at the heat source into an appropriate sink. When metal-to-metal contact is required in the thermal transfer process, the amount of direct surface-to-surface contact area determines the heat transfer efficiency.