Browse Prior Art Database

Au/Sn/Ag Braze Alloy

IP.com Disclosure Number: IPCOM000066010D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Ainslie, N Hitt, GE Slayton, G Sullivan, JF Wild, RN [+details]

Abstract

A new Au/Sn/Ag (70Au/25Sn/5Ag) braze alloy for brazing electronic package components together is described. This alloy enables pin or electronic component brazing, followed by thermal treatments in the 300-350 degrees C range. Certain Pb-Sn chip join cycles are possible with this alloy.