Au/Sn/Ag Braze Alloy
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19
A new Au/Sn/Ag (70Au/25Sn/5Ag) braze alloy for brazing electronic package components together is described. This alloy enables pin or electronic component brazing, followed by thermal treatments in the 300-350 degrees C range. Certain Pb-Sn chip join cycles are possible with this alloy.